The die has two CCXs (Core Complexes — core clusters on the same die), much like we saw in older AMD Zen 2 chips. Both core types have their own private L1 and L2 caches, but the 24MB of L3 cache is split into a 16MB slice for the standard cores and an 8MB slice for the Zen 5c compact cores.
These two L3 caches have to communicate with each other over the data fabric, much like the CCX-to-CCX cache coherency mechanism found with AMD’s older Zen 2 architecture. This introduces higher latency for cache-to-cache transfers